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For Simple Boards - Most of the things listed below will not apply, but it might be a good idea to read through the list
anyway.
- General Information:
- Project Name:
- Board Name:
- PWB Number / Fab Drawing Number (if different)
- PCB Assembly Number / Assembly Drawing Number (if different)
- Schematic Drawing Number
- Bill of Materials (BOM) Number
- Assembly Panel Number / Panel Drawing Number (if different)
- Mechanical
- Board Dimensions and Thickness (include tolerances)
- Mounting and Tooling holes: locations and sizes (include tolerances)
- Locations of critical components
- Connectors
- LED's
- Switches
- Tall components
- Heatsinks
- Others ...
- Max Component Heights
- Top Side
- Bottom Side
- Keepouts
- Components
- Copper
- Traces / Etch
- Vias
- Component height restriction
- Components requiring special clearances
- For Heatsinks
- For Sockets: programming , emulator, etc...
- For SIMM or DIMM modules
- For large mating connectors
- Electrical
- Expected number of layers
- Stackup:
- Is there an existing one?
- Do you need us to generate one?
- Copper weights per layer
- Board Technology
- Thru Hole
- SMT
- Blind / Buried Via technology?
- HDI or Sequential Lamination?
- Please list any Noisy or sensitive nets or buses
- List any components that will not be on production boards
- Test / Debug Headers
- Sockets
- Others ....
- Do you desire the outer layers to be flooded with copper for shielding?
- Grounding schem
- Signal ground
- Earth ground
- Safety Ground
- Analog and Digital ground
- Do the mounting holes need to be tied to ground? If so, which one?
- High Speed Requirements
- Single ended impedance requirement
- Diff pair impedance
- Special dielectrics
- Burried Capacitance
- Clock Speeds
- Special Rules
- Delay
- Matched Delay
- Relative Propagation Delay
- Max Via Count
- Max Stub Lengths
- Xnets and Topologies
- Ground Stitching at board edge
- Crosstalk limits or concerns
- Are there buses or nets that must or can't reference a particular voltage?
- Hand Routing critical nets or net priorities
- Thermal
- Specify Air flow direction
- Copper Areas for thermal dissipation
- Heatsink requirements
- List of the hot parts so we won't place them downstream
- Power and Planes
- Input Voltage. Is it high voltage?
- Do you have a preferrence on what supply voltage goes on what layer?
- For Split planes, do you have an idea of what voltages to combine on a layer?
- Are there any high current nets? How many Amps?
- List any special Creepage & Clearances
- Panel Layout
- Panel Tooling Holes: size and locations
- Panel Fiducials: size and locations
- Depanalization schem
- V-Score with pizza cutter
- breakaway tabs, mouse bites, dog bones
- Manufacturing and Assembly
- List any Special Silkscreen
- Logos
- Assembly number and Box for dash numbers
- Serial Number Outline
- LED Labels
- Voltage labels
- HIGH VOLTAGE or WARNING labels
- Switch, Reset, Dipswitch, Jumpers, Programing, etc..
- Wave solder
- Direction if bottom side parts will be waved
- Will a Selective Solder Pallet be used
- Notes
- Special Fab notes
- Special Assembly notes
- Special Details on Assembly Drawing
- A list of all names and positions to be on the drawings. Here are some options:
- Electrical Engineer
- Mechanical Engineer
- Compliance / Safety
- Manufacturing Engineer
- Project Engineer
- Power Engineer
- CAD Engineer - That's us :-)
- Surface Finish
- HASL
- Silver
- Gold
- White Tin
- Other ...
- Special Soldermask or Silkscreen colors (default is green mask and white ink)
- Test Strategy
- Do you need test points for ICT Fixture (bed of nails)?
- Do you need testpoints for flying probe?
- Do you require 100% TP coverage?
- Is JTAG and Boundary Scan in the test plan?
- Are there nets that will not require test access?
- Files we will need
- Netlist
- Datasheets for anything that is not standard (0603, so-8, etc..)
- Mechanical drawings
- Schematic in .pdf format (notes or instructions can be on the schematic)
- A block diagram showing basic functionality, data flow, and clock trees can be helpful
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